ADC 6021 Dokumentacja Pobierz pdf (Strona 8)

MYXPM6021*

Revision 1.1 - 10/21/14

*Advanced information. Subject to change without notice.

MYXPM6021*

Form #: CSI-D-685 Document 011

5 Operating Conditions

All voltages are referenced to VSS unless otherwise stated. Currents owing into MYXPM6021 are deemed positive,

currentsowingoutaredeemednegative.

Allparametersarevalidoverthefulloperatingtemperaturerangeandpowersupplyrangeunlessotherwisenoted.Please

notethatthepowerdissipationmustbelimitedtoavoidoverheatingofMYXPM6021.Themaximumpowerdissipation

shouldnotbereachedwithmaximumambienttemperature.

Table 1: Absolute Maximum Ratings

Parameter Conditions Min Max Unit Val

Storage Temperature TSTOR -65 +150 °C Q

Operating Temperature free-air TAMB -30 +85 °C E

Power Supply Input VSUP -0.3 +5.5 V E/Q

IO Input (All unless otherwise stated) -0.3 VSUP+0.3 V Q

Maximum Power Dissipation 60°C ambient temperature

55mmx100mmx0.75mm PCB

2.0 W D, E

Package Thermal Resistance TBD K/W D, E

ESD CDM (Charge Device Model) All pins unless otherwise stated. ±500 V Q

ESD HBM (Human Body Model) All pins unless otherwise stated. ±2 kV Q

Table 2: Recommended Operating Conditions

Parameter Conditions Min Max Unit Val

Operating Temperature Free-Air TAMB -30 +85 °C E,Q

Power Supply Input VSUP 2.7 4.5 V E,Q

Themaximumallowedoperationaldietemperatureis125°C.Belowyoucanndthetimeconstraintsinrelationtothe

peakpowerdissipation.Thesimulationresultsarebasedon:

• 10layerboard,70x170x0.8mm3

• Naturalconvection,airvelocity0m/s

• Surface-to-surfaceradiation

• Packageinitializesat0.25Wwithinitialtemperatureof38°C

• Surroundingambienttemperatureinimmediatevicinityat31°C

• Maximumpowerburstexposureof100s

Variouspowerburstscenariosat:0.76,0.96,1.20,2.90,3.72,4.52and7.0W

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ADC 6021 Dokumentacja Strona 8